Thermally Conductive, Thin Glue Line Adhesive
CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as .001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65’ C to 155’ C. When cured, CC3-341 is not adversely affected by moisture, humidity or saly spray, and will withstand repeated cycling through a wave solder machine.
CHOICE OF HARDENERS:
H-1 Hardener: Rigid, good dimensional stability, fast cure.
H-7 Hardener: Resilient, excellent mechanical and thermal shock, low viscosity,
good air release, fast cure.
Ancamine Z: Resilient, excellent mechanical and thermal shock, plus high heat
distortion, long pot life.
ROOM TEMPERATURE CURE:
H-1 Hardener: Cures overnight at room temperature or 2 hrs at 65’ C.
Do not heat cure if the mass exceeds 200 grams.
H-7 Hardener: Cures overnight at room temperature or 2 hrs at 65’ C.
Ancamine Z: Cures overnight at 65’ C or 4 hrs at 125’ C. For best physical and electrical properties, a slow cure for 16 hours at 65’ C followed by a post cure for 4 hours at 125’ C is recommended.
Mix CC3-341 thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 6.4 grams of H-1 Hardener and 100 grams of CC3-341 for a total mix of 106.4 grams) Mix thoroughly. Evacuate the mix for 5 to 15 minutes in order to insure a void free glue line. Apply to both mating surfaces. Work the sufaces together, squeezing out the excess adhesive in order to obtain a thin bond line. The parts should be held securely in place with moderate pressure to prevent movement during cure. Use in a well ventilated area and avoid contact with eyes and skin.