CC3-341

 

Thermally Conductive, Thin Glue Line Adhesive

CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as .001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65’ C to 155’ C. When cured, CC3-341 is not adversely affected by moisture, humidity or salt spray, and will withstand repeated cycling through a wave solder machine.

ELECTRICAL AND PHYSICAL PROPERTIES:   
Specific Gravity at 25’ C: (uncatalyzed) 1.74
(catalyzed) 1.70
Viscosity cps at 22 ½’ C: (uncatalyzed)  4-10-200  9,500
(catalyzed)  4-20-200 4,100
Standard Color Black
Shelf Life 12 months
Tensile Strength @ 25’ C, psi  8,298
Tensile Elongation: % @ yield  1.7 to 1.9
Compressive Strength @ 25’ C, psi  23,400
Izod Impact: ft lbs/in of notch 0.25
Heat Distortion: ‘C  145
Water Absorption: %, 10 days @ 25’ C  0.2
Linear Shrinkage: in/in  0.0025
Service Temperature, ‘C continuous -65 to +125
Service Temperature, ‘C intermittent  -100 to +160
Hardness: Shore D 84 to 88
Bond Shear Strength: Al to Al 1” overlap: psi @ 25’ C, 3,840
Thermal Conductivity: W/mK 1.1
Thermal Resistence: ‘C in/watt 35.6
Coefficient of Thermal Expansion: in/in/’C x 10-6  26
Volume Resistivity @ 25’ C, ohm-cm 1016
Dielectric Constant @ 25’ C, 100 KC 5.7
Dissipation Factor @ 25’ C, 100 KC 0.02
Dielectric Strength:  volts/mil 300 – 350
(Typical properties when cured with H-1 Hardener )

CC3-341

CHOICE OF HARDENERS:
H-1 Hardener: Rigid, good dimensional stability, fast cure.
H-18 Hardener:

Resilient, excellent mechanical and thermal shock, low viscosity, good air release, fast cure.

H-10LV Hardener: Variable hardness, excellent impact properties, long pot life

HARDENER

PARTS BY WEIGHT
PER 100 PARTS OF RESIN

POT LIFE
100 GRAM
25’C (77’F)

CURE TIME
25′ C
(77’F)

CURE TIME
65′ C
(149′ F)

CURE TIME
125 ‘ C
(257 ‘ F)

H-1 Hardener

6.4

2 hrs.

24 hrs.

2 hrs.

– – –

H-18 Hardener

13.3

3 hrs.

24 hrs.

2 hrs.

– – –

H-10LV Hardener

__rigid _______ _-_15

3 hrs.

24 hrs.

3 hrs.

– – –

H-10LV Hardener

__semi-flex _____ _40

3 hrs.

24 hrs.

3 hrs.

– – –

H-10LV Hardener

__flexible ________62

3 hrs.

24 hrs.

3 hrs.

– – –

 

ROOM TEMPERATURE CURE:
H-1 Hardener:

Cures overnight at room temperature or 2 hrs at 65’ C.
Do not heat
cure if the mass exceeds 200 grams.

H-18 Hardener:

Cures overnight at room temperature or 2 hrs at 65’ C.

H-10LV Hardener: Cures overnight at room temperatureor 3 hrs at 65’ C.

MIXING INSTRUCTIONS:

 Mix CC3-341 thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 6.4 grams of H-1 Hardener and 100 grams of CC3-341 for a total mix of 106.4 grams) Mix thoroughly. Evacuate the mix in order to insure a void free glue line. Apply to both mating surfaces. Work the surfaces together, squeezing out the excess adhesive in order to obtain a thin bond line. The parts should be held securely in place with moderate pressure to prevent movement during cure.

* The data herein is offered as a guide and does not constitute a specification. Cast Coat, Inc. makes no warranty express or implied as to the accuracy or completeness. Each user should evaluate the material to determine its suitability for his/her particular purpose. User assumes all risk and liability resulting from its use.