CC3-341
Thermally Conductive, Thin Glue Line Adhesive
CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as .001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65’ C to 155’ C. When cured, CC3-341 is not adversely affected by moisture, humidity or salt spray, and will withstand repeated cycling through a wave solder machine.
| ELECTRICAL AND PHYSICAL PROPERTIES: | ||
| Specific Gravity at 25’ C: (uncatalyzed) | 1.74 | |
| (catalyzed) | 1.70 | |
| Viscosity cps at 22 ½’ C: (uncatalyzed) 4-10-200 | 9,500 | |
| (catalyzed) 4-20-200 | 4,100 | |
| Standard Color | Black | |
| Shelf Life | 12 months | |
| Tensile Strength @ 25’ C, psi | 8,298 | |
| Tensile Elongation: % @ yield | 1.7 to 1.9 | |
| Compressive Strength @ 25’ C, psi | 23,400 | |
| Izod Impact: ft lbs/in of notch | 0.25 | |
| Heat Distortion: ‘C | 145 | |
| Water Absorption: %, 10 days @ 25’ C | 0.2 | |
| Linear Shrinkage: in/in | 0.0025 | |
| Service Temperature, ‘C continuous | -65 to +125 | |
| Service Temperature, ‘C intermittent | -100 to +160 | |
| Hardness: Shore D | 84 to 88 | |
| Bond Shear Strength: Al to Al 1” overlap: psi @ 25’ C, | 3,840 | |
| Thermal Conductivity: W/mK | 1.1 | |
| Thermal Resistence: ‘C in/watt | 35.6 | |
| Coefficient of Thermal Expansion: in/in/’C x 10-6 | 26 | |
| Volume Resistivity @ 25’ C, ohm-cm | 1016 |
|
| Dielectric Constant @ 25’ C, 100 KC | 5.7 | |
| Dissipation Factor @ 25’ C, 100 KC | 0.02 | |
| Dielectric Strength: volts/mil | 300 – 350 | |
| (Typical properties when cured with H-1 Hardener ) | ||
CC3-341
| CHOICE OF HARDENERS: | ||
| H-1 Hardener: | Rigid, good dimensional stability, fast cure. | |
| H-18 Hardener: |
Resilient, excellent mechanical and thermal shock, low viscosity, good air release, fast cure. |
|
| H-10LV Hardener: | Variable hardness, excellent impact properties, long pot life | |
|
HARDENER |
PARTS BY WEIGHT |
POT LIFE |
CURE TIME |
CURE TIME |
CURE TIME |
|
H-1 Hardener |
6.4 |
2 hrs. |
24 hrs. |
2 hrs. |
– – – |
|
H-18 Hardener |
13.3 |
3 hrs. |
24 hrs. |
2 hrs. |
– – – |
|
H-10LV Hardener |
__rigid _______ _-_15 |
3 hrs. |
24 hrs. |
3 hrs. |
– – – |
|
H-10LV Hardener |
__semi-flex _____ _40 |
3 hrs. |
24 hrs. |
3 hrs. |
– – – |
|
H-10LV Hardener |
__flexible ________62 |
3 hrs. |
24 hrs. |
3 hrs. |
– – – |
| ROOM TEMPERATURE CURE: | ||
| H-1 Hardener: |
Cures overnight at room temperature or 2 hrs at 65’ C. |
|
| H-18 Hardener: |
Cures overnight at room temperature or 2 hrs at 65’ C. |
|
| H-10LV Hardener: | Cures overnight at room temperatureor 3 hrs at 65’ C. | |
MIXING INSTRUCTIONS:
Mix CC3-341 thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 6.4 grams of H-1 Hardener and 100 grams of CC3-341 for a total mix of 106.4 grams) Mix thoroughly. Evacuate the mix in order to insure a void free glue line. Apply to both mating surfaces. Work the surfaces together, squeezing out the excess adhesive in order to obtain a thin bond line. The parts should be held securely in place with moderate pressure to prevent movement during cure.
* The data herein is offered as a guide and does not constitute a specification. Cast Coat, Inc. makes no warranty express or implied as to the accuracy or completeness. Each user should evaluate the material to determine its suitability for his/her particular purpose. User assumes all risk and liability resulting from its use.